![]() ![]() In practice, I usually find myself using the following settings: Deviceģ50 to 380☌ (660 to 720☏), with low to medium airflow. You do want to spread out the heat to reduce thermal stress on a single point, but doing so increases the desoldering time.Īs you can see, there are a lot of things to keep in mind when selecting the right temperature on your soldering iron or hot air rework station. Moving the nozzle back and forth over the desoldering area does the same. Holding the nozzle further from the component increases the area over which the heat spreads. If you are using a hot air rework station, the distance from the nozzle to the component.More layers means more copper, which means more heat being conducted through the board away from the component. These are large areas of metal that further increase the amount of heat required to desolder the component. Any ground, power and/or thermal planes that the component is connected to.Basically, the more metal, the more heat you need to introduce to melt the solder. On the other hand, small surface mount components barely have any thermal mass. If the component is large, has large pins or has a heatsink, it takes more heat to heat up. The mass of the component that you are desoldering. ![]() Leaded solder has a lower melting point than lead-free solder, and thus can be desoldered at a lower temperature.
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